DSA2H003066.pdf by Aries Electronics

Partial File Text CSP/MICRO BGA Test & Burn-in Socket for Devices Up to 40mm Sq. FEATURES: · For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. · Any pitch device on 0.40mm or larger. · 4 Poi
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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