DSA2H003456.pdf by Aries Electronics

Partial File Text CSP/µBGA Test & Burn-In Socket for Devices up to 13mm Square FEATURES ·For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications ·Any pitch devic
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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