DSARS0027796.pdf by Altera

Partial File Text Altera Device Package Information 400-Pin Wirebond FineLine Ball-Grid Array (FBGA) All dimensions and tolerances conform to ANSI Y14.5M 1994. Controlling dimension is in millimeters. M
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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JEDEC FBGA 11 MS-034