DSA00298192.pdf by Philips Semiconductors

Partial File Text PDF: 2003 Apr 07 Philips Semiconductors Package outline HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad SOT527-1 E
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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