DSASW00220554.pdf by KOA Speer Electronics

Partial File Text NETWORKS Hybrid IC MULTI CHIP MODULE · SYSTEM iN PACKAGE MCM CONSTRUCTION SMD SMD Bonding Wire Bonding Wire Solder Ball Solder Ball Bare Chip Bare Chip Substrate Substrate S
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSASW00220554.pdf preview

Download Datasheet

User Tagged Keywords

distance ring FR4 0.8mm thickness FR4 height thickness substrate fr4 substrate FR4 substrate height and thickness FR4 substrate height and thickness 1.2 ltcc chip