DSASW00220628.pdf by KOA Speer Electronics

Partial File Text KA, SC hybrid IC EU features · Adjustment processes are decreased by function and ratio trimmings · High density mounting by bonding (COB) · Various types of package are available · High r
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSASW00220628.pdf preview

Download Datasheet

User Tagged Keywords

0.4mm pitch BGA AI2O3 BGA and QFP Package mounting hybrid ic sc ka Noble resistor pitch 0.4mm BGA QFP 0.2mm pitch QFP 0.3mm pitch QFP lead pitch 0.3mm