DSASW00220652.pdf by KOA Speer Electronics

Partial File Text MCM multi-chip module features · SMD (Hybrid IC) · Plural semiconductors in one package offers downsized system with high performance and standardization · Wiring space saving by multilayer
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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FR4 0.8mm thickness FR4 substrate height and thickness FR4 substrate height and thickness 1.2 ltcc chip