DSA00151146.pdf by Aries Electronics

Partial File Text 3155-111-18N REPLACES NATIONAL SEMICONDUCTOR DP7310J .3 DIP WITH TI SN74ACT564DWJ LEAD PACKAGE FEATURES: · Allows placing an SOIC (narrow body) on a board laid out for an SOWIC (wide body). · So
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ASTM-B16-85 DP7310J