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Partial File Text 1.1 General Parameters Technology Chip size Packages 0.5 (im C M O S, four-layer metal 196 m m 2, 12.4 m m x 15.8 mm Surface-m ount 304-pin C 4-C Q FP Surface-m ount 255-lead ceramic hall grid array
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RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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