DSA0024877.pdf by Integrated Device Technology

Partial File Text QQ S Selection Guide and Packaging Information UALITY EMICONDUCTOR, INC. Thermal Characteristics Thermal Characteristics of QSI Packages Package H HQSOP, 150-mil HB LF (10x10x1.4) J
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16 QSOP pcb footprint 16 soic pcb footprint QS6611 qsop 16 pcb footprint qsop 24 footprint QVSOP SOIC-24 SSOP20 SSOP20 300 mil Footprint SSOP48 SSOP56 TSSOP48 TSSOP56