DSA0025544.pdf by Intersil

Partial File Text Hermetic Packages for Integrated Circuits Ceramic Dual-In-Line Metal Seal Packages (SBDIP) D28.6 MIL-STD-1835 CDIP2-T28 (D-10, CONFIGURATION C) LEAD FINISH c1 -A- 28 LEAD CERAMIC DUAL-IN-L
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