DSA0027220.pdf by Intersil

Partial File Text Plastic Packages for Integrated Circuits Thin Shrink Small Outline Plastic Packages (TSSOP) M38.173 N INDEX AREA E 0.25(0.010) M E1 2 INCHES GAUGE PLANE -B1 38 LEAD THI
Datasheet Type Original
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Pb Free Unknown
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JEDEC MO-153 MO-153-BD-1 MO-153BD-1

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