The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSA00157636.pdf
by QuickLogic
Partial File Text
APPNote #37 BGA Board Level Assembly and Rework Recommendations 4/19/00 Abstract This application note provides the recommendations for board level assembly for the ballgrid array (BGA) package
Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
Price & Stock
Find it at Findchips.com
DSA00157636.pdf
preview
Download Datasheet
User Tagged Keywords
"ball collapse" height
BGA "direct replacement"
bga rework
Cu-56
entek Cu-56
stencil tension
thick bga die size
Price & Stock Powered by