DSA0035772.pdf by M/A-COM

Partial File Text Moisture Effects on the Soldering of Plastic Encapsulated Devices S2080 V4 Introduction Improper packaging, storage, and handling of plastic encapsulated devices (PED's) can trap moisture wit
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J-STD-033 JEDEC J-STD-033 JESD22-A113 moisture handling and packaging moisture sensitive handling and packaging moisture sensitivity Moisture Sensitivity Level Rating S2080 s2083

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