DSA0037438.pdf by Mitsubishi

Partial File Text MITSUBISHI INTEGRATED CIRCUIT PACKAGES PROPERTIES OF PACKAGE MATERIALS 7. PROPERTIES OF PACKAGE MATERIALS Principal package material characteristics are shown in the following tables. Table 1
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock Find it at Findchips.com

DSA0037438.pdf preview

Download Datasheet

User Tagged Keywords

AuSn eutectic eftec 45 MF202 MgO Al2O3 Thermal conductivity coefficient properties fe -80 ni SC-101 Si3N4 silicon carbide

Price & Stock Powered by