Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSASW00131.pdf by NXP Semiconductors

    • AN10343 MicroPak soldering information Rev. 2 -- 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array (BGA), Wafer-Level
    • Original
    • Unknown
    • Unknown
    • Unknown
    • Find it at Findchips.com

    DSASW00131.pdf preview

    Price & Stock Powered by
    Supplyframe Tracking Pixel