DSA2H0051229.pdf by Foxconn

Partial File Text SPECIFICATIONS BGA 754 DT BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05X.05"] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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