DSA00838.pdf

Partial File Text White Paper Chun Howe Sim Thermal Mechanical Application Engineer Jason Loh Thermal Mechanical Application Engineer Fanless Cooling for Embedded Applications Intel Corporation January
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

DSA00838.pdf preview

Download Datasheet

User Tagged Keywords

37.5x37.5 82801DB 852GM 855GME Al grade 6063 heat and mass transfer INTEL fcBGA PACKAGE thermal resistance JEDEC-51-2 JEDEC51 mmx black anodized aluminum plate Shinetsu X23 ULV373 x23-7783D

Price & Stock Powered by