TI recommends a 4-layer PCB with a solid ground plane, and a separate power plane for the XIO2000AZZZ. Keep the analog and digital grounds separate, and use a common mode choke to filter the power supply.
Use a reliable clock source, ensure proper signal termination, and implement error detection and correction mechanisms, such as CRC or checksums, to ensure data integrity.
The XIO2000AZZZ has a maximum junction temperature of 150°C. Ensure good thermal conductivity between the device and the PCB, and consider using a heat sink or thermal pad for high-power applications.
Power up the device in the following sequence: VCC, then VCCIO, and finally the clock signal. Ensure a clean reset signal, and consider using a reset supervisor or a power-on reset circuit.
Use a shielded enclosure, and ensure proper grounding and bonding of the PCB and components. Implement EMI filters, such as ferrite beads or common mode chokes, to reduce emissions.
XIO2000AZZZ datasheet
by Texas Instruments
