The recommended land pattern for WSL2816R0680FEH is a rectangular pad with a size of 1.6 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and thermal performance.
To ensure proper thermal management, it's recommended to use a thermal pad or a heat sink with a thermal interface material (TIM) to dissipate heat. The thermal pad should be at least 1 mm thick and have a thermal conductivity of 1 W/m-K or higher.
The maximum operating temperature range for WSL2816R0680FEH is -55°C to +150°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range for extended periods.
Yes, WSL2816R0680FEH is suitable for high-frequency applications up to 1 GHz. However, it's essential to consider the device's self-resonant frequency, parasitic inductance, and capacitance when designing the circuit.
To ensure reliability in harsh environments, it's recommended to follow proper soldering and assembly techniques, use a conformal coating, and consider using a moisture-resistant package. Additionally, ensure that the device is operated within its specified ratings and derate the power accordingly.
