The recommended land pattern for WSL20101L000FEA is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
Yes, WSL20101L000FEA is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating.
To prevent electrostatic discharge (ESD) damage, handle WSL20101L000FEA components in an ESD-protected environment, use ESD-safe packaging, and follow proper handling and storage procedures.
The recommended soldering profile for WSL20101L000FEA is a peak temperature of 260°C, with a dwell time of 10-30 seconds. It's essential to follow the recommended soldering profile to prevent damage to the component.
Yes, WSL20101L000FEA is designed to withstand vibrations up to 10 G. However, it's essential to ensure that the component is properly secured to the PCB and that the PCB is designed to withstand the expected vibration levels.
