The recommended land pattern for WSL0603R0100DEA18 is a rectangular pad with a size of 0.65 mm x 0.65 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
WSL0603R0100DEA18 is rated for operation up to 150°C, but it's recommended to derate the power rating at higher temperatures. Consult the datasheet for derating curves and consult with a thermal expert if you're unsure.
WSL0603R0100DEA18 is an ESD-sensitive device. Handle it with ESD-protective equipment, such as wrist straps, mats, and bags. Avoid touching the component pins or body, and ensure that your assembly process follows ESD-safe practices.
The recommended soldering profile for WSL0603R0100DEA18 is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second. Consult the datasheet for more details.
WSL0603R0100DEA18 is not hermetically sealed, so it's not recommended for use in humid environments. If you must use it in a humid environment, ensure that the component is properly sealed or coated to prevent moisture ingress.