A 4-layer PCB with a dedicated ground plane and careful routing of analog and digital signals is recommended. The datasheet provides a recommended PCB layout, but additional guidelines can be found in the Cirrus Logic application note AN215.
To minimize power consumption, ensure that the device is in the correct power mode (e.g., idle or shutdown) when not in use. Additionally, optimize the clock frequency, use the internal voltage regulator, and minimize the use of external components.
The device has a maximum junction temperature of 150°C. Ensure good airflow, use a heat sink if necessary, and follow the recommended PCB layout to minimize thermal resistance. Thermal simulation and modeling can also be used to optimize the design.
Check the ADC clock frequency, ensure proper signal routing and shielding, and verify that the analog input signals are within the specified range. Also, consult the datasheet and application notes for troubleshooting guidelines and ADC calibration procedures.
Follow the recommended PCB layout and shielding guidelines to minimize EMI. Ensure that the device is properly decoupled, and use EMI filters or shielding on sensitive signals. Consult the datasheet and application notes for additional EMI and EMC guidelines.