The recommended PCB footprint for the VS-HFA25TB60-N3 is a rectangle with dimensions of 2.5 mm x 1.5 mm, with a thermal pad of 2.1 mm x 1.1 mm in the center.
Yes, the VS-HFA25TB60-N3 is rated for operation up to 150°C, but it's essential to ensure proper thermal management and follow the recommended derating guidelines to prevent overheating.
To ensure reliability, follow the recommended storage and handling guidelines, use a clean and dry environment, and avoid exposing the device to mechanical stress or electrical overstress. Additionally, consider using a fuse or overcurrent protection to prevent damage from excessive current.
The VS-HFA25TB60-N3 is suitable for high-frequency applications up to 100 kHz, but it's essential to consider the device's parasitic capacitance and inductance, as well as the PCB layout and design, to minimize signal degradation and ensure optimal performance.
The typical lead time for the VS-HFA25TB60-N3 varies depending on the region, distributor, and quantity. However, it's usually around 8-12 weeks. It's recommended to check with authorized distributors or Vishay Intertechnologies directly for the most up-to-date lead time information.
