The recommended PCB footprint for the VS-HFA08TB120PBF is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a thermal pad size of 2.5 mm x 2.5 mm. The recommended solder mask clearance is 0.1 mm.
To ensure reliable soldering of the VS-HFA08TB120PBF, use a soldering iron with a temperature of 250°C to 260°C, and a solder with a melting point of 217°C to 221°C. Apply a small amount of solder paste to the PCB pads, and use a reflow oven or a hot air gun to solder the component.
The maximum allowed voltage derating for the VS-HFA08TB120PBF is 10% of the rated voltage, which is 108 V for this component. This means that the maximum allowed voltage is 97.2 V.
During storage and shipping, the VS-HFA08TB120PBF should be stored in a dry, cool place, away from direct sunlight and moisture. The component should be handled with anti-static wrist straps or mats to prevent electrostatic discharge damage.
The recommended thermal management for the VS-HFA08TB120PBF is to use a heat sink with a thermal resistance of 10°C/W or lower, and to ensure good airflow around the component. The maximum junction temperature should not exceed 150°C.
VS-HFA08TB120PBF datasheet
by Vishay Semiconductors
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