The recommended PCB footprint for the VS-ETH0806-M3 is a rectangular pad with dimensions of 1.5 mm x 0.8 mm, with a 0.3 mm radius corner. The pad should be centered on the component centerline, and the solder mask should be 0.1 mm from the pad edge.
The VS-ETH0806-M3 has a high power density, so thermal management is crucial. Ensure good airflow around the component, and consider using a heat sink or thermal interface material to reduce the thermal resistance. The maximum junction temperature is 150°C, so ensure the component is operated within the recommended temperature range.
The recommended soldering profile for the VS-ETH0806-M3 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
To ensure the reliability of the VS-ETH0806-M3, follow the recommended storage and handling procedures, and ensure the component is operated within the recommended voltage and current ratings. Also, perform thorough testing and inspection during the manufacturing process, and consider using a burn-in process to screen out early failures.
The VS-ETH0806-M3 is designed to withstand moderate vibration levels, but it's essential to ensure the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method. Additionally, consider using a vibration-dampening material or a shock-absorbing mount to reduce the vibration amplitude.
VS-ETH0806-M3 datasheet
by Vishay Semiconductors
