The recommended PCB footprint for the VS-60APU06PBF is a rectangular pad with a size of 6.5mm x 3.5mm, with a thermal pad in the center. The pad should have a solder mask defined (SMD) and a solder paste layer.
To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pad. Use a soldering technique that minimizes the risk of overheating the component.
The maximum operating temperature range for the VS-60APU06PBF is -40°C to 150°C. However, the device can withstand storage temperatures up to 200°C for short periods of time.
The VS-60APU06PBF is not hermetically sealed, so it's not recommended for use in high-humidity environments. However, if you must use it in such an environment, ensure that the device is properly sealed or coated to prevent moisture ingress.
Handle the VS-60APU06PBF by the body, avoiding touching the leads or electrical contacts. Store the device in its original packaging or in a dry, cool place, away from direct sunlight and moisture.
VS-60APU06PBF datasheet
by Vishay Semiconductors
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