The recommended PCB footprint for the VS-40CPQ080PBF is a rectangular pad with a size of 4.5mm x 2.5mm, with a 1.5mm x 1.5mm thermal pad in the center. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) area around the thermal pad.
To ensure reliable soldering of the VS-40CPQ080PBF, use a soldering iron with a temperature of 250°C to 260°C, and apply a solder paste with a melting point of 217°C to 221°C. The soldering time should be limited to 3-5 seconds, and the component should be handled by the edges to prevent damage.
The maximum power dissipation of the VS-40CPQ080PBF is 40W, but this value can be derated based on the ambient temperature and the thermal resistance of the PCB. It's recommended to use a thermal analysis tool to determine the maximum power dissipation for a specific application.
Yes, the VS-40CPQ080PBF is compatible with lead-free soldering processes. The component is RoHS-compliant and can be soldered using lead-free solder pastes with a melting point of 217°C to 221°C.
The typical thermal resistance of the VS-40CPQ080PBF is 2.5°C/W (junction-to-case) and 10°C/W (junction-to-ambient). However, these values can vary depending on the PCB design, thermal interface material, and ambient temperature.
