A symmetrical PCB layout with a central ground plane and minimal track lengths is recommended to minimize electromagnetic interference (EMI) and ensure optimal performance.
Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended derating curves for high-temperature operation. Additionally, consider using a thermistor or thermal sensor to monitor the device temperature.
The maximum allowable voltage stress during switching is 1.5 times the maximum rated voltage (VDRM) for a duration not exceeding 10 ms. Exceeding this limit may lead to device failure.
Yes, but with caution. Ensure that the devices are matched for voltage and current ratings, and that the parallel configuration is designed to minimize current imbalance and thermal mismatch. Consult Vishay's application notes for more information.
Store the devices in their original packaging or in a conductive bag, and handle them with ESD-protective equipment and clothing. Follow standard ESD handling procedures, such as those outlined in ANSI/ESD S20.20.
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