A recommended PCB layout for VO217AT is to use a thermal pad with a minimum size of 2.5 mm x 2.5 mm, and to ensure that the thermal pad is connected to a large copper area on the PCB to dissipate heat efficiently.
To ensure reliability in high-temperature applications, it's essential to follow the recommended derating curves, keep the junction temperature below 150°C, and use a suitable thermal interface material between the device and the heat sink.
The maximum allowable voltage for VO217AT is 200 V, but it's recommended to operate the device within the specified voltage range of 50 V to 170 V to ensure reliable operation and minimize the risk of damage.
Yes, VO217AT can be used in switching applications, but it's essential to ensure that the device is operated within the specified switching frequency range and that the switching losses are minimized to prevent overheating.
To select the correct heat sink for VO217AT, consider the device's power dissipation, ambient temperature, and airflow. A heat sink with a thermal resistance of less than 10°C/W is recommended, and the heat sink should be designed to ensure good thermal contact with the device.
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