STMicroelectronics recommends a 2-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently.
Use a heat sink, ensure good airflow, and consider derating the device's current handling capability according to the temperature derating curve in the datasheet.
A 10uF to 22uF X7R or X5R ceramic capacitor is recommended, placed as close to the VIN pin as possible, to filter out high-frequency noise and ensure stable operation.
Use a TVS diode or a zener diode to clamp overvoltages, and consider adding a fuse or a PTC resettable fuse to protect against overcurrent conditions.
Keep the output stage traces short and away from sensitive analog signals, use a ground plane to shield the output stage, and consider adding a common-mode choke or ferrite bead to reduce EMI.