STMicroelectronics recommends a 2-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently.
Implement a thermal management strategy, such as heat sinks or fans, and ensure the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C.
A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for input decoupling, placed as close to the VIN pin as possible.
Use a shielded enclosure, keep the PCB layout compact, and ensure proper grounding and decoupling. Additionally, consider using EMI filters or common-mode chokes if necessary.
The EN pin should not exceed the supply voltage (VIN) and should be limited to a maximum of 6V to prevent damage to the device.