STMicroelectronics provides a recommended PCB layout in the application note AN4979, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
The VND830 has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the PCB.
The VND830 is rated for operation from -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. The device should be derated for operation above 85°C to ensure reliability.
The VND830 has a low-power mode that can be enabled by pulling the EN pin low. In this mode, the device consumes less power, but the output voltage is not regulated. The device can also be put into shutdown mode by pulling the EN pin low and the VCC pin low.
The recommended input capacitor value for the VND830 is 10uF to 22uF, with a voltage rating of at least 6.3V. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
VND830 datasheet
by STMicroelectronics
