STMicroelectronics recommends a 2-layer or 4-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently.
Use a heat sink with a thermal resistance of 10°C/W or lower, and ensure good airflow around the device. Also, consider derating the device's current handling capability at high temperatures.
Use a gate drive circuit with a low impedance output stage, such as a push-pull stage or a dedicated gate driver IC, to minimize switching losses and ensure reliable operation.
Use a TVS diode or a zener diode to clamp overvoltages, and consider adding a current sense resistor and a comparator to detect overcurrent conditions and shut down the device if necessary.
A dead time of 100-200 ns is recommended to prevent shoot-through currents and ensure reliable operation.