STMicroelectronics recommends a 2-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently.
Use a heat sink, ensure good airflow, and consider derating the device's current handling capability according to the temperature derating curve in the datasheet.
The SOA is limited by the maximum junction temperature (Tj) of 150°C. Ensure that the device operates within the recommended voltage and current ranges to avoid overheating.
Yes, the VN02HSP is qualified according to the AEC-Q101 standard for automotive applications and is suitable for use in high-reliability environments.
Use proper handling and storage procedures, ensure a safe and controlled environment during assembly, and consider adding external protection devices such as TVS diodes or ESD protection arrays.