A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
Use a thermal management strategy such as heat sinks, thermal pads, or thermal interfaces to keep the junction temperature below 125°C. Ensure good airflow and avoid thermal hotspots.
Sequence the power supplies in the following order: VCC, AVCC, DVCC, and VREF. Ramp up the voltage slowly (e.g., 10 ms) to prevent damage from inrush currents.
Use the power-down mode, disable unused features, and adjust the clock frequency to minimize power consumption. Consider using a low-power mode or dynamic voltage and frequency scaling.
Handle the device by the body or use an anti-static wrist strap. Use ESD-protective packaging and follow proper handling procedures to prevent damage from static electricity.