The recommended PCB footprint for VDRS14G030BSE is a rectangular pad with dimensions of 2.5 mm x 1.5 mm, with a thermal pad of 2.5 mm x 2.5 mm. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) area for the thermal pad.
To ensure reliable soldering of VDRS14G030BSE, use a soldering iron with a temperature of 260°C to 280°C, and a solder with a melting point of 217°C to 220°C. Apply a small amount of solder paste to the PCB pad, and use a reflow oven or a hot air gun to solder the component.
The maximum operating temperature range for VDRS14G030BSE is -55°C to 150°C. However, the device can withstand short-term excursions up to 175°C during soldering or other manufacturing processes.
To handle ESD protection for VDRS14G030BSE, use an ESD wrist strap or mat, and ensure that the PCB and components are properly grounded. Avoid touching the component pins or handling the component in a way that could generate static electricity.
The recommended storage condition for VDRS14G030BSE is in a dry, cool place with a temperature range of 20°C to 30°C and a relative humidity of 50% to 60%. Avoid storing the component in direct sunlight or near sources of moisture.
