The recommended PCB footprint for VBT10200C-E3/4W is a rectangular pad with dimensions of 2.5 mm x 1.5 mm, with a 0.5 mm radius corner and a 0.3 mm spacing between pads.
While the VBT10200C-E3/4W is rated for operation up to 150°C, it's recommended to derate the power dissipation at higher temperatures to ensure reliability. Consult the datasheet for derating curves and consult with a thermal expert if necessary.
To ensure reliability in high-humidity environments, follow proper PCB design and assembly guidelines, including using a moisture-resistant coating, conformal coating, or potting. Additionally, consider using a humidity sensor to monitor the environment and take corrective action if necessary.
The recommended soldering profile for VBT10200C-E3/4W is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Consult the datasheet for more detailed soldering guidelines.
While the VBT10200C-E3/4W is designed to withstand normal vibration, it's recommended to consult with a mechanical engineer to ensure the device is properly secured and the PCB is designed to withstand the expected vibration levels.
VBT10200C-E3/4W datasheet
by Vishay Semiconductors
