The recommended PCB footprint for the VB30100SG-E3/4W is a rectangular pad with dimensions of 12.7 mm x 7.62 mm (0.5 in x 0.3 in) with a 1.27 mm (0.05 in) spacing between the pads.
Yes, the VB30100SG-E3/4W is rated for operation up to 150°C (302°F), making it suitable for high-temperature applications. However, it's essential to ensure that the device is properly derated to prevent overheating and ensure reliable operation.
The VB30100SG-E3/4W has a maximum surge current rating of 100 A for 10 ms, making it suitable for applications that require high surge current capability.
Yes, the VB30100SG-E3/4W is compatible with lead-free soldering processes, making it suitable for use in RoHS-compliant applications.
The typical junction-to-case thermal resistance (RθJC) for the VB30100SG-E3/4W is 0.5°C/W, which is relatively low, indicating good heat dissipation capabilities.
VB30100SG-E3/4W datasheet
by Vishay Semiconductors
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