The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum size of 10mm x 10mm, and ensuring good thermal conductivity between the pad and the surrounding copper area. Additionally, it's recommended to use a minimum of 2oz copper thickness and to avoid placing any thermal vias under the device.
To ensure reliable soldering of the V60120C-E3/4W, it's recommended to follow the recommended soldering profile, which involves a peak temperature of 260°C for 10-30 seconds. Additionally, the device should be soldered using a solder with a melting point of 217°C or higher, and the PCB should be designed with a solder mask to prevent solder bridging.
The maximum allowed voltage derating for the V60120C-E3/4W is 80% of the rated voltage, which is 1200V. This means that the device can be operated at a maximum voltage of 960V without compromising its reliability or performance.
The V60120C-E3/4W has an integrated ESD protection diode, but it's still recommended to take additional precautions to prevent ESD damage. This includes using an ESD wrist strap or mat during handling, storing the devices in anti-static packaging, and ensuring that the PCB design includes ESD protection components such as TVS diodes or resistors.
The V60120C-E3/4W should be stored in a dry, cool place away from direct sunlight and moisture. The devices should be stored in their original packaging or in a similar anti-static packaging, and should not be exposed to temperatures above 30°C or humidity above 60%. Additionally, the devices should be handled using ESD-safe materials and tools to prevent damage.
V60120C-E3/4W datasheet
by Vishay Semiconductors
