Murata recommends a PCB layout with a solid copper plane under the module, and thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
Yes, the UEI30-033-Q12P-C is designed to meet the vibration requirements of IEC 60068-2-6, but it's recommended to perform additional testing to ensure the module meets the specific vibration requirements of your application.
Murata recommends using a reflow soldering process with a peak temperature of 240°C ± 5°C, and a dwell time of 30-60 seconds above 220°C. Hand soldering is not recommended.
The maximum capacitance load is not explicitly stated in the datasheet, but as a general rule, Murata recommends limiting the output capacitance to 10uF or less to ensure stability and prevent oscillation.
Yes, the UEI30-033-Q12P-C can be used in a redundant or parallel configuration, but it's recommended to consult with Murata's application engineers to ensure proper design and implementation.
