TI recommends a 4-layer PCB with a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer to improve heat dissipation. A minimum of 2 oz copper thickness is recommended for the top layer.
The UCD3020ARGZR has a specific power sequencing requirement. The VDD rail should be powered up first, followed by the VCC rail, and then the VIN rail. The device also has a power-good output (PGOOD) that can be used to monitor the power supply status.
The maximum allowed voltage on the VIN pin is 6.5V. Exceeding this voltage can cause damage to the device. It's recommended to use a voltage regulator or a voltage limiter to ensure the input voltage remains within the specified range.
The UCD3020ARGZR has a built-in OCP feature that can be enabled by connecting the OCP pin to a resistor and a capacitor. The OCP threshold can be set by selecting the appropriate resistor value. TI provides a calculation tool to determine the required resistor value based on the desired OCP threshold.
The recommended clock frequency for the I2C interface is 400 kHz. However, the device can operate at clock frequencies up to 1 MHz. It's essential to ensure that the clock frequency is within the specified range to avoid communication errors.
UCD3020ARGZR datasheet
by Texas Instruments
