A good PCB layout for the UCC3895DWG4 involves keeping the input and output stages separate, using a star-ground configuration, and placing the input filter components close to the IC. Additionally, using a solid ground plane and minimizing trace lengths can help reduce EMI.
The choice of input filter components depends on the specific application requirements, such as input voltage, frequency, and desired attenuation. A good starting point is to use the recommended component values in the datasheet, and then adjust based on simulation and experimentation.
The maximum allowable voltage drop across the internal voltage regulator is typically around 5V, but this can vary depending on the specific application and operating conditions. It's recommended to consult the datasheet and application notes for more information.
Proper thermal management involves providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the IC. The UCC3895DWG4 has a thermal pad on the bottom of the package, which should be connected to a heat sink or thermal plane on the PCB.
Common pitfalls to avoid include not following proper PCB layout guidelines, not using adequate input filtering, and not providing sufficient thermal management. Additionally, not following the recommended operating conditions and not using the correct output capacitor values can also lead to issues.