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    Part Img UCC28C45MDREP datasheet by Texas Instruments

    • PMIC - AC DC Converters, Offline Switchers, Integrated Circuits (ICs), IC OFFLINE CTRLR PWM UVLO 8SOIC
    • Original
    • Yes
    • Yes
    • Active
    • EAR99
    • 8542.39.00.01
    • 8542.39.00.00
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    UCC28C45MDREP datasheet preview

    UCC28C45MDREP Frequently Asked Questions (FAQs)

    • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Additionally, keeping the thermal pad and heat sink away from high-frequency signals and noise sources is crucial.
    • To ensure reliable start-up and shutdown, it is essential to follow the recommended start-up and shutdown sequences outlined in the datasheet. This includes ensuring that the input voltage is within the recommended range, and that the soft-start capacitor is properly sized. Additionally, using a voltage supervisor or a power-on reset circuit can help ensure reliable start-up and shutdown.
    • To ensure EMI and EMC compliance, it is essential to follow good PCB layout practices, such as keeping high-frequency signals away from sensitive analog circuits, using shielding and filtering where necessary, and ensuring that the device is properly decoupled. Additionally, using a common-mode choke and a differential-mode filter can help reduce EMI emissions.
    • To optimize the UCC28C45MDREP for low standby power consumption, it is essential to ensure that the device is properly shut down during standby mode. This can be achieved by using a low-dropout regulator or a switch-mode regulator to power the device, and by using a low-power oscillator or a clock generator. Additionally, using a power-good signal to detect when the output voltage is within regulation can help reduce standby power consumption.
    • To ensure proper thermal management, it is essential to provide adequate heat sinking and thermal conduction paths. This can be achieved by using a heat sink with a high thermal conductivity, and by ensuring good thermal contact between the device and the heat sink. Additionally, using a thermal interface material can help reduce thermal resistance.
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