A good PCB layout for the UCC28810DR involves keeping the input and output stages separate, using a star-ground configuration, and placing the input filter components close to the IC. Additionally, using a solid ground plane and minimizing trace lengths can help reduce EMI.
The choice of input filter components depends on the specific application requirements, such as input voltage, current, and frequency. A good starting point is to use the recommended component values from the datasheet, and then adjust based on simulation and experimentation.
The UCC28810DR can deliver up to 10A of output current, but this depends on the specific application and thermal conditions. It's essential to ensure proper thermal management and heat sinking to achieve the maximum output current.
The UCC28810DR has a built-in overcurrent protection feature that can be enabled by connecting the OCP pin to a resistor divider network. The resistor values can be calculated based on the desired overcurrent threshold and the application requirements.
A good thermal management strategy for the UCC28810DR involves using a heat sink with a thermal resistance of less than 10°C/W, ensuring good airflow, and keeping the IC away from other heat sources. Additionally, using thermal interface materials and thermal pads can help improve heat transfer.
UCC28810DR datasheet
by Texas Instruments
