UCC2800MDREP datasheet by Texas Instruments

UCC2800MDREP Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the UCC2800MDREP to minimize EMI?
  A good PCB layout for the UCC2800MDREP involves keeping the high-frequency components (e.g., the transformer, diodes, and capacitors) close together, using a solid ground plane, and minimizing the length of the high-current paths. TI provides a recommended layout in the datasheet and application notes.
• How do I choose the right transformer for my UCC2800MDREP design?
  When selecting a transformer for the UCC2800MDREP, consider the output power, input voltage, and switching frequency. TI provides a transformer selection guide in the datasheet and application notes. You can also use online transformer selection tools or consult with a transformer manufacturer.
• What is the maximum ambient temperature for the UCC2800MDREP?
  The UCC2800MDREP has a maximum ambient temperature rating of 85°C (185°F). However, the device's junction temperature (TJ) should not exceed 150°C (302°F) to ensure reliable operation.
• Can I use the UCC2800MDREP in a non-isolated topology?
  No, the UCC2800MDREP is designed for isolated topologies, such as flyback converters. It is not suitable for non-isolated topologies like buck or boost converters.
• How do I implement overvoltage protection (OVP) with the UCC2800MDREP?
  The UCC2800MDREP has a built-in OVP feature that can be enabled by connecting the OVP pin to a voltage divider network. The OVP threshold is set by the voltage on the OVP pin. Consult the datasheet for more information.