A good PCB layout for the UCC27524ADR involves keeping the high-frequency switching nodes (e.g., SW and VIN) away from sensitive analog nodes, using a solid ground plane, and minimizing loop areas to reduce EMI. TI provides a recommended PCB layout in the datasheet and application notes.
When selecting an input capacitor for the UCC27524ADR, consider the capacitor's voltage rating, capacitance value, and ESR (equivalent series resistance). A low-ESR capacitor with a voltage rating above the maximum input voltage and a capacitance value in the range of 10-22 μF is recommended. TI provides guidance on input capacitor selection in the datasheet and application notes.
The UCC27524ADR has an operating ambient temperature range of -40°C to 125°C. As the ambient temperature increases, the device's performance may degrade, and the maximum output current may decrease. Ensure proper thermal design and heat sinking to maintain a safe operating temperature.
The UCC27524ADR has a built-in OCP and SCP feature. To implement OCP, connect a sense resistor (Rs) between the output and GND, and set the OCP threshold voltage (Vocp) using an external resistor divider. For SCP, connect a sense resistor (Rs) between the output and GND, and set the SCP threshold voltage (Vscp) using an external resistor divider. Refer to the datasheet for detailed implementation guidelines.
The recommended output capacitor value for the UCC27524ADR is in the range of 10-47 μF, depending on the output voltage and desired ripple. A low-ESR capacitor with a voltage rating above the maximum output voltage is recommended. The output capacitor value affects the output voltage ripple, with a larger capacitor value resulting in lower ripple.
UCC27524ADR datasheet
by Texas Instruments
