UCC27424DR datasheet by Texas Instruments

UCC27424DR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the UCC27424DR to minimize electromagnetic interference (EMI)?
  A good PCB layout for the UCC27424DR involves keeping the high-frequency switching nodes (e.g., SW and VIN) away from sensitive analog nodes, using a solid ground plane, and minimizing trace lengths and loops. TI provides a recommended layout in the application note SLUA623.
• How do I ensure the UCC27424DR is properly thermally managed?
  Proper thermal management involves providing a heat sink or thermal pad to the exposed pad of the QFN package, ensuring good thermal conductivity to the PCB, and keeping the device away from heat sources. TI recommends a thermal resistance of ≤10°C/W for the heat sink.
• What are the key considerations for selecting the input capacitor (CIN) for the UCC27424DR?
  When selecting CIN, consider the voltage rating, capacitance value, and equivalent series resistance (ESR). A low-ESR capacitor with a voltage rating ≥ VIN(max) and a capacitance value ≥ 10µF is recommended. X5R or X7R ceramic capacitors are suitable options.
• How do I optimize the output capacitor (COUT) selection for the UCC27424DR?
  For COUT, choose a capacitor with a voltage rating ≥ VOUT(max), a capacitance value ≥ 10µF, and a low ESR. Consider the output voltage ripple and transient response requirements when selecting COUT. A low-ESR ceramic or polymer capacitor is recommended.
• What are the key considerations for selecting the inductor (L) for the UCC27424DR?
  When selecting L, consider the inductance value, DC resistance, and saturation current. Choose an inductor with a high saturation current rating, low DC resistance, and an inductance value that meets the required output voltage and current requirements.