A good PCB layout for the UCC27211DPRT involves keeping the high-frequency switching nodes (e.g., SW node) away from sensitive analog nodes, using a solid ground plane, and minimizing the length of the power traces. TI provides a recommended PCB layout in the application note SLUA623.
To ensure proper thermal management, ensure good airflow around the device, use a heat sink if necessary, and follow the thermal design guidelines in the datasheet. The UCC27211DPRT has a thermal pad that must be connected to a solid ground plane to dissipate heat efficiently.
When selecting output filter components, consider the desired output voltage ripple, output current, and switching frequency. A good starting point is to use the component values suggested in the datasheet, and then adjust based on the specific application requirements.
To troubleshoot issues with the UCC27211DPRT, start by verifying the PCB layout and component selection. Check for proper decoupling, correct component values, and ensure that the input voltage is within the recommended range. Use an oscilloscope to observe the switching waveforms and identify any anomalies.
The main difference between the UCC27211DPRT and the UCC27210DPRT is the maximum switching frequency. The UCC27211DPRT can operate up to 2.2 MHz, while the UCC27210DPRT is limited to 1.2 MHz. The UCC27211DPRT also has a slightly higher maximum input voltage rating.