UCC27211DDAR datasheet by Texas Instruments

UCC27211DDAR Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for the UCC27211DDAR to minimize EMI?
  A good PCB layout for the UCC27211DDAR involves keeping the high-frequency switching nodes (e.g., SW node) away from sensitive analog nodes, using a solid ground plane, and minimizing loop areas. TI provides a recommended layout in the datasheet and application notes.
• How do I choose the right external components (e.g., inductor, capacitor) for the UCC27211DDAR?
  Choose external components based on the specific application requirements, such as output voltage, current, and switching frequency. TI provides a component selection guide in the datasheet and application notes. You can also use online tools, such as TI's Power Stage Designer, to help with component selection.
• What is the maximum ambient temperature range for the UCC27211DDAR?
  The UCC27211DDAR has an operating ambient temperature range of -40°C to 125°C. However, the maximum junction temperature (TJ) is 150°C. Ensure that the device is properly cooled to maintain a safe operating temperature.
• How do I implement overcurrent protection with the UCC27211DDAR?
  The UCC27211DDAR has a built-in overcurrent protection (OCP) feature. Set the OCP threshold by connecting a resistor (ROC) between the OCP pin and GND. The device will shut down if the current exceeds the set threshold. You can also use an external circuit to implement more complex OCP schemes.
• Can I use the UCC27211DDAR in a synchronous rectification topology?
  Yes, the UCC27211DDAR can be used in synchronous rectification topologies. The device's low RDS(on) and fast switching times make it suitable for high-efficiency synchronous rectification applications.